How to accelerate the drying speed of thermal conductive adhesive

Thermal conductive adhesive takes 1-2 hours to fully cure in general environments. Accelerating drying can be achieved by increasing
 temperature, reducing humidity, decreasing thickness, selecting appropriate materials, or using methods such as jetting, heating, 
applying pressure, and using accelerators.

Thermal conductive adhesive is a widely used thermal interface material in fields such as electronics and electrical appliances, and its
drying time is crucial for ensuring product performance and production efficiency. So, how long does it take for thermal conductive 
adhesive to dry? How can we accelerate its drying speed?

1、 Drying time of thermal glue

The drying time of thermal glue is mainly affected by four factors: temperature, humidity, thickness, and material. Under normal environmental conditions, such as room temperature of 20-25 degrees Celsius and relative humidity of around 50%, thermal conductive adhesive usually takes 1-2 hours to fully cure. But if the ambient temperature is low or the humidity is high,the drying time will be extended. In addition, the thicker the thermal conductive adhesive applied, the longer the drying time required.
The curing speed of different types of thermal  adhesive materials will also vary.

2、 Methods to accelerate the drying of thermal glue

In order to shorten the drying time of thermal conductive adhesive and improve production efficiency, the following methods can
 be adopted:

1. Adjust environmental conditions: Increasing the ambient temperature and reducing humidity can accelerate the drying speed
of thermal conductive adhesive. For example, using heating equipment and dehumidifiers in a drying room to achieve an ideal
drying environment.

2. Reduce application thickness: While ensuring thermal conductivity, try to minimize the application thickness of thermal conductive
 adhesive, which can significantly reduce drying time.

3. Choose the appropriate material: Choose a thermal conductive adhesive material with faster curing speed according to the specific
application scenario. For example, some silicone based thermal conductive adhesives may have faster curing speeds.

4. Adopting auxiliary drying methods: such as using jet equipment to spray air onto the surface of the thermal conductive adhesive,
 accelerating the evaporation of surface moisture; Or use a heating plate to heat the thermal conductive adhesive, increase the internaltemperature, and promote the curing reaction; Pressure can also be applied to the surface of the thermal conductive adhesive to help
 eliminate internal bubbles and improve drying quality.

5. Use accelerators: Adding an appropriate amount of accelerators, such as organic solvents or catalysts, to the thermal conductive adhesive can accelerate its chemical reaction rate, thereby shortening the drying time. However, it should be noted that the type and amount of accelerator should be determined based on the specific properties of the thermal conductive adhesive to avoid affecting 
the final product's performance.

In summary, by adjusting environmental conditions reasonably, reducing coating thickness, selecting appropriate materials, and using
 auxiliary drying methods and accelerators, the drying speed of thermal conductive adhesive can be effectively accelerated and 
production efficiency can be improved.