Method for removing thermal glue thermal adhesive 

TM900 Thermal glue is a material used for heat dissipation, typically found in electronic devices and circuits.
To remove thermal conductive silicone, the following methods can be used:

1. Physical removal method: Use a pointed tool (such as a knife or scissors) to gently scrape off the thermal conductive silicone.
 Make sure not to scratch the surrounding components or circuit boards.

2. Dissolution and removal method: Soak the thermal conductive silica gel in a suitable solvent, such as toluene, acetone, alcohol,
or butanone. After waiting for a period of time, the thermal conductive silicone will dissolve, and then it can be gently wiped clean
with a cotton swab or brush.

3. Heating removal method: Use a hot air gun or hot plate to heat the conductive silicone gel. After heating, the thermal conductive
silicone will soften and can be easily removed with tweezers or a knife.

Regardless of which method is used, careful operation is necessary to avoid damaging surrounding devices or circuit boards.
In addition, it is recommended to understand the properties and characteristics of thermal conductive silicone before operation
 and to use appropriate personal protective equipment to ensure safe operation.